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Sputtering Metalized Fiber

A metal film is deposited on the fiber surface by sputtering process. Metalized fiber can be soldered into a package to achieve hermetical sealing and provide high environmentally reliable interconnection for optical devices. The metalized fiber is widely used in passive and active devices.

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Product Detail

Key Features	Applications
Hermetical Sealing	Hermetic Feed-Throughs
High Environmentally Reliable Interconnection	Integrated Optics Packaging
	Diode Pigtailing

Specifications
Parameter	Unit	Value
Film Composition	-	Ti/Ni/Au (other materials available on request)
Coating Thickness	nm	100-1000 (other thickness available on request)
Plating Length Tolerance	mm	± 1
Polarization Extinction Ratio (PM Fiber Type)	dB	≥ 20
Recommended Minimum Bend Diameter	mm	25
Helium Leak Rate	Pa.m³/s	≤ 1.0 × 10 ^{- 9}
Pull Strength	N	≥ 5
Fiber Length Tolerance	%	± 10 or specify
Recommended Soldering Temperature	℃	< 300
Recommended Soldering Time	S	< 3
Storage Temperature	℃	- 40 to + 85

¹Single or dual zone metallization available, mid-span metallization available.

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Sputtering Metalized Fiber

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For Optical Network

Sputtering Metalized Fiber

1310/1550 nm 5/10 W Single Fiber Collimator

1310/1480/1550 nm Mini Type MVOA