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Sputtering Metalized Fiber

It is deposited on the fiber surface by sputtering process.
  • Product Detail

A metal film is deposited on the fiber surface by sputtering process. Metalized fiber can be soldered into a package to achieve hermetical sealing and provide high environmentally reliable interconnection for optical devices. It is widely used in passive and active devices.

Specifications

Parameter

Unit

Value

Film composition

-

Ti / Ni / Au (other materials available on request)

Coating thickness

nm

100 - 1000 (other thickness available on request)

Plating length tolerance

mm

± 1

Polarization extinction ratio (PM fiber type)

dB

≥ 20

Recommended minimum bend diameter

mm

25

Helium leak rate

Pa.m3/s

≤ 1.0*10-9

Pull strength

N

≥ 10

Fiber length tolerance

%

± 10 or specified

Recommended soldering temperature

< 300

Storage temperature

- 40 to + 85

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