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Sputtering Metalized Fiber

It is deposited on the fiber surface by sputtering process.
  • Product Detail

A metal film is deposited on the fiber surface by sputtering process. Metalized fiber can be soldered into a package to achieve hermetical sealing and provide high environmentally reliable interconnection for optical devices. It is widely used in passive and active devices.


Specifications

Parameter

Unit

Value

Film composition

Ti/ Ni/ Au (other materials available on request)

Coating thickness

nm

100-1000 (other thickness available on request)

Plating length tolerance

mm

± 1

Polarization extinction ratio(PM fiber type)

dB

20

Recommended minimum bend diameter

mm

25

Helium leak rate

Pa.m3/s

1.0*10-9

Pull strength

N

10

Fiber length tolerance

%

± 10 or specify

Recommended soldering temperature

<300

Storage temperature

-40 to +85

 



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