Copenhagen, Denmark – October 01, 2025 – AFR Milan, a subsidiary of Advanced Fiber Resources (AFR), successfully participated in the European Conference on Optical Communication (ECOC) 2025, held in Copenhagen, Denmark, from September 29 to October 1.

With AI and enabling technologies such as high-speed modulators, detachable FAUs, and CPO being a central focus throughout the conference and trade show, AFR and its subsidiaries are proud to present a comprehensive product portfolio that addresses key market demands.

Featured Products from AFR Milan

AFR Milan introduced its advanced photonic chips and modulators to meet the growing needs of next-generation networks:

• 400 Gbps/lane TFLN Modulator Chip – Purpose-built for PAM-4 transmission, capable of supporting 1.6 Tbps (DR4/FR4) or 3.2 Tbps (DR8/FR8).
• 130 GBaud CDM (Coherent Driver Modulator) – With power consumption below 3.5 W and an optical extinction ratio ≥ 23 dB, enabling DP-QPSK, DP-16QAM, and DP-64QAM coherent transmission.
• 40 GHz TFLN IQ Modulator – Featuring electro-optic bandwidth > 25 GHz and high linearity, suitable for OFDM, QPSK, QAM formats, and FMCW LiDAR.
• C-Band and 1060 nm Phase Modulator – Combining high linearity, low drive voltage, and compact footprint, supporting modulation up to 10 GHz for ultra-fast high-power lasers and quantum applications.

Innovations from AFR Subsidiaries: B&A and Vlink

Alongside AFR Milan’s showcase, AFR subsidiaries B&A and Vlink highlighted significant advances:

• 4-Pump Raman Amplifier (B&A) – Extends support to C++ bands, delivering low noise figure, flat gain, and high reliability for backbone and coherent transmission networks.
• Single Channel Nano EDFA (B&A) – A compact, low-power amplifier providing up to 6 dBm output power, optimized for single-channel systems and data center interconnects (DCI).
• 2D FAU for WSS (Vlink) – An innovative nonlinear 2D fiber array unit that achieves precise waveguide matching and improved coupling efficiency, enhancing optical path stability in wavelength selective switching (WSS) systems.

In  his  presentation, titled “Ultrafast  Post-Selection  Free Time-Bin  Entanglement  on  a Thin Film Lithium Niobate Photonic Chip,” Bernardi introduced a fully packaged, chip-integrated receiver  for  time-bin   entanglement  certification  that   eliminates  the   need  for  temporal post-selection — a first-of-its-kind  implementation  using an integrated  photonic  platform. The   device   is   based   on   AFR’s   commercial-grade   TFLN   technology   and   demonstrates high-speed operation with switching  rates  up to 5 GHz,  low  driving voltage (Vπ as  low as 3.37 V), and compatibility with CMOS electronics.

This  work  underscores  the   potential  of  AFR’s  TFLN  platform  for   real-world  quantum applications, marking a key milestone toward scalable, high-speed quantum networks. AFR remains committed to advancing integrated photonics through innovation, industrial-grade fabrication, and strong collaboration with leading research institutions.