In  his  presentation, titled “Ultrafast  Post-Selection  Free Time-Bin  Entanglement  on  a Thin Film Lithium Niobate Photonic Chip,” Bernardi introduced a fully packaged, chip-integrated receiver  for  time-bin   entanglement  certification  that   eliminates  the   need  for  temporal post-selection — a first-of-its-kind  implementation  using an integrated  photonic  platform. The   device   is   based   on   AFR’s   commercial-grade   TFLN   technology   and   demonstrates high-speed operation with switching  rates  up to 5 GHz,  low  driving voltage (Vπ as  low as 3.37 V), and compatibility with CMOS electronics.

This  work  underscores  the   potential  of  AFR’s  TFLN  platform  for   real-world  quantum applications, marking a key milestone toward scalable, high-speed quantum networks. AFR remains committed to advancing integrated photonics through innovation, industrial-grade fabrication, and strong collaboration with leading research institutions.