March 25, 2024 - Dr. Sy Rhee attended the forum titled "Technologies and Applications of Thin Film Lithium Niobate Photonics," organized jointly by AFR and HyperLight. During the forum, Dr. Rhee presented a speech titled "TFLN opportunities," discussing the key target applications and future prospects of thin-film lithium niobate photonics technology.

About Sy Rhee and Fujitsu Optical Components

Sy Rhee is the COO (Chief Operating Officer) of Fujitsu Optical Components America, a subsidiary of Fujitsu Optical Components, Ltd (FOC). He has over 20 years of vast experience in the optical components industry covering product development, marketing, and sales roles. Prior to joining FOC in 2005, Sy was a member of technical staff at Fujitsu Compound Semiconductor and NeoPhotonics. Sy holds Ph.D. degree in Mechanical Engineering from The Ohio State University.

Fujitsu Optical Components (FOC) plays a significant role in optical device and optical module products market. In the supply chain of the TFLN, Fujitsu Optical Components is a leading supplier of TFLN chip and optical devices that are based on TFLN.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - Dr. Xinlun Cai attended the AFR and HyperLight-hosted forum on "Technologies and Applications of Thin Film Lithium Niobate Photonics," delivering a presentation on "High Speed and Low Power Consumption TFLN Devices."

About Xinlun Cai and Liobate

Dr. Xinlun Cai did his PhD in Bristol University, U.K. In 2014, he joined Sun Yat-sen University in China doing research in photonic integrated devices based on silicon and thin-film lithium niobate. He demonstrated a hybrid integrated silicon and TFLN modulators with bandwidth of > 70 GHz, the first IQ TFLN modulators and the first dual-polarization TFLN modulators. The TFLN modulators he demonstrated are with bandwidth of > 110 GHz and half-wave voltage of < 1 V, which is the state-of-the-art. In 2020, he co-founded Liobate Technologies aiming to developing TFLN devices for data-center and AI applications.

Liobate Technologies successfully developed high-speed optical communication chips and devices based on TFLN electro-optic modulator technology. Liobate Technologies is dedicated to developing thin-film lithium niobate modulator photonic integrated circuits and related optical communications and interconnect sub-assemblies.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight , Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions abut the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - Dr. Mingzhi Lu attended the AFR and HyperLight-hosted forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics." At the forum, Dr. Lu delivered a presentation titled "Advantages and Challenges of Thin-Film Lithium Niobate Photonic Integrated Circuits," offering a comprehensive overview of the benefits and challenges associated with TFLN technology.

About Mingzhi Lu and Ori-Chip

Mingzhi Lu received the B.S. degree from Southeast University in 2008, and M.S. and Ph.D. degrees from University of California, Santa Barbara in 2009 and 2013, respectively, in electrical and computer engineering. He also worked as a postdoctoral researcher from 2013 to 2014 at University of California, Santa Barbara. His research was mainly focused on photonic integration and optical phase-locked loops. From 2014 to 2018, he worked at Infinera Corp. on large scale photonic integration for 200G,400G and 800G coherent communication. In 2018, he co-founded Ori-Chip Optoelectronics Technology Co. LTD., making widely tunable lasers, thin-film lithium niobate PICs and DFB laser diodes for communication and sensing markets.

Ori-Chip Optoelectronics Technology has established a full range of semiconductor production lines from R&D and design to chip production, automatic testing and aging verification, and is a leading optical communication chip solution provider in the supply chain of lithium niobate.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - Dr. Jianying Zhou attended the AFR and HyperLight co-host forum, discussing the latest advancements in Thin Film Lithium Niobate Photonics. His presentation, titled "Exploiting Thin Film Lithium Niobate Photonics for New Generation Optical Transceivers in Data Center Applications," highlighted the potential of this technology in enhancing data transmission efficiency.

About Jianying Zhou and Hisense Broadband

Jianying Zhou is currently the VP of Technology at Hisense Broadband. Previously, he was a Director of R&D and a Principal Engineer with Intel Corporation, a Director of Design and Technology with NeoPhotonics Corporation, and a number of professional positions with Oclaro, Finisar, Nortel, JDS, etc. He has been working in the optoelectronics and fiber-optic communication industries for over 25 years. In recent years, he has conducted advanced photonics technology and product development with contributions in a number of conference presentations and journal papers, including a top scored paper in OFC 2019, an invited paper in OFC 2020, a postdeadline paper in 2023 IEEE Silicon Photonics Conference, and invited papers in JLT and JSTQE. His interests include silicon photonics, emerging photonic technology, photonic integration, and advanced packaged and optical transceivers.

Hisense Broadband is a global leader in the development and manufacturing of advanced fiber optical transceivers and multimedia terminals. With over 20 years of experience, Hisense Broadband provides one-stop solutions for Datacom, transmission, wireless and access networks.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - Richard Xiao was a featured speaker at the "Technologies and Applications of Thin Film Lithium Niobate Photonics" forum, hosted jointly by AFR and HyperLight. His presentation, titled " Opportunities and challenges of Applying TFLN in High Speed Optical Transceivers," provided an insightful analysis of the current state and future prospects of this emerging technology.

About Richard Xiao and Linktel

Richard Xiao is the Vice President at Linktel Technologies, where he is involved in the development of emerging technologies for the next generation of optical interconnections, such as 200G per Lane, Thin Film Lithium Niobate, Silicon Photonics, etc. Prior to joining Linktel, he worked in various leadership and engineering roles at Alcatel-Lucent, Tellabs, Cisco, and TFC. He has more than 20 years of industry experience in product development, commodity management, and product marketing.

Linktel is a technology-oriented company that specializes in pluggable transceivers for Metro, Wireless, Access, Enterprise networks, and Data Centers, as well as optical engines used in high-speed optical links and transceiver modules. Linktel's 800G optical transceiver with TFLN modulator meets the high-speed requirements of data-heavy applications.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - At the "Technologies and Applications of Thin Film Lithium Niobate Photonics" forum co-hosted by AFR and HyperLight, Dr. Hui Hu gave a speech entitled "Thin Film Lithium Niobate for Integrated Photonics," discussing the latest advancements and potential applications of thin film lithium niobate in the field of integrated photonics.

About Hui Hu and NanoLN

Hui Hu earned his B.S. and Ph.D. degrees in Physics from Shandong University in 1996 and 2001, respectively. From 2001 to 2003, he was a post-doc at Tsinghua University, China. From 2004 to 2010, he was in University of Paderborn, Germany, as an Alexander von Humboldt Research Fellow and a post-doc. Since 2011, he has been the CTO of NanoLN company and a professor at Shandong University. His research is focused on thin film materials, nanofabrication, and integrated photonics.

NanoLN is specialized in producing single-crystal lithium niobate thin films (TFLN/LNOI) and single-crystal lithium tantalate thin films (TFLT/LTOI). It also provides wafer thinning and PECVD (Plasma-enhanced chemical vapor deposition) services for its customers, enabling them to use the wafer for production.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.