TFLN FORUM | Dr. Xinlun Cai: High Speed and Low Power Consumption TFLN Devices Mar 27, 2024

March 25, 2024 - Dr. Xinlun Cai attended the AFR and HyperLight-hosted forum on "Technologies and Applications of Thin Film Lithium Niobate Photonics," delivering a presentation on "High Speed and Low Power Consumption TFLN Devices."

Dr. Xinlun Cai at the TFLN forum

About Xinlun Cai and Liobate

Dr. Xinlun Cai did his PhD in Bristol University, U.K. In 2014, he joined Sun Yat-sen University in China doing research in photonic integrated devices based on silicon and thin-film lithium niobate. He demonstrated a hybrid integrated silicon and TFLN modulators with bandwidth of > 70 GHz, the first IQ TFLN modulators and the first dual-polarization TFLN modulators. The TFLN modulators he demonstrated are with bandwidth of > 110 GHz and half-wave voltage of < 1 V, which is the state-of-the-art. In 2020, he co-founded Liobate Technologies aiming to developing TFLN devices for data-center and AI applications.

Liobate Technologies successfully developed high-speed optical communication chips and devices based on TFLN electro-optic modulator technology. Liobate Technologies is dedicated to developing thin-film lithium niobate modulator photonic integrated circuits and related optical communications and interconnect sub-assemblies.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight , Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions abut the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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