March 25, 2024 - Dr. Jianying Zhou attended the AFR and HyperLight co-host forum, discussing the latest advancements in Thin Film Lithium Niobate Photonics. His presentation, titled "Exploiting Thin Film Lithium Niobate Photonics for New Generation Optical Transceivers in Data Center Applications," highlighted the potential of this technology in enhancing data transmission efficiency.
About Jianying Zhou and Hisense Broadband
Jianying Zhou is currently the VP of Technology at Hisense Broadband. Previously, he was a Director of R&D and a Principal Engineer with Intel Corporation, a Director of Design and Technology with NeoPhotonics Corporation, and a number of professional positions with Oclaro, Finisar, Nortel, JDS, etc. He has been working in the optoelectronics and fiber-optic communication industries for over 25 years. In recent years, he has conducted advanced photonics technology and product development with contributions in a number of conference presentations and journal papers, including a top scored paper in OFC 2019, an invited paper in OFC 2020, a postdeadline paper in 2023 IEEE Silicon Photonics Conference, and invited papers in JLT and JSTQE. His interests include silicon photonics, emerging photonic technology, photonic integration, and advanced packaged and optical transceivers.
Hisense Broadband is a global leader in the development and manufacturing of advanced fiber optical transceivers and multimedia terminals. With over 20 years of experience, Hisense Broadband provides one-stop solutions for Datacom, transmission, wireless and access networks.
Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain
The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.
In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.
As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.
