San Jose, California – October 15, 2026— Advanced Fiber Resources (AFR) showcased its advanced optical component portfolio for AI datacenter interconnects at the 2026 OCP Global Summit, held October 12–15 in San Jose, California. At Booth T3, AFR highlighted fiber array units (FAUs), thin-film lithium niobate (TFLN) modulator chips, a 130-GBaud coherent driver modulator (CDM), and high-performance optical circulators—key enabling technologies for next-generation optical connectivity supporting 800G, 1.6T, and beyond.
As AIDCs continue to scale, the demand for optical interconnectivity products is growing at a record pace. AFR’s portfolio addresses these evolving requirements through four key product categories:
Fiber Array Units (FAU) – including 2D FAU for CPO/OCS applications, MT-FAU for 1.6T/3.2T high-speed optical modules, and PM FAU with a high polarization extinction ratio (PER) for ELSFP applications, addressing the requirements of different optical interconnect architectures.
TFLN Modulator Chips – the 400 Gbps/ch chip, built for PAM-4 transmission, supports 1.6 Tbps (DR4/FR4) or 3.2 Tbps (DR8/FR8); the 200G/ch LPO PAM-4 and 800G DR8 chips deliver low-power, high-bandwidth solutions for the ultra-high-speed optical modules used in datacenters and AI computing clusters.
TFLN 130 GBaud CDM (Coherent Driver Modulator) – With power consumption below 3.5 W and an optical extinction ratio of 23 dB or higher, enabling DP-QPSK, DP-16QAM, and DP-64QAM coherent transmission.
High-Performance Optical Circulators – Offered in 3- to 5-port configurations, these circulators deliver low insertion loss and high isolation, and are now scalable for volume production, serving as critical components for 800G/1.6T upgrades.
