Vlink’s High-Density Fiber Array Unit (FAU) is engineered for ultra-high-channel-count optical interconnection scenarios, including silicon photonics chip packaging, co-packaged optics (CPO) and next-generation hyperscale data center networks. Manufactured with high-precision V-groove substrate technology, it delivers industry-leading fiber core positioning accuracy, ultra-low insertion loss and excellent optical uniformity even at extreme channel density. Supporting a wide range of channel counts and customizable fiber pitch options, this product provides a compact, reliable and scalable optical interconnection solution for 51.2T/102.4T switching systems and high-performance computing (HPC) architectures.