Key Features | Applications |
Hermetical Sealing | Hermetic Feed-Throughs |
High Environmentally Reliable Interconnection | Integrated Optics Packaging |
Diode Pigtailing |
Parameter | Unit | Value |
Film Composition | - | Ti/Ni/Au (other materials available on request) |
Coating Thickness | nm | 100-1000 (other thickness available on request) |
Plating Length Tolerance | mm | ± 1 |
Polarization Extinction Ratio (PM Fiber Type) | dB | ≥ 20 |
Recommended Minimum Bend Diameter | mm | 25 |
Helium Leak Rate | Pa.m3/s | ≤ 1.0 × 10-9 |
Pull Strength | N | ≥ 5 |
Fiber Length Tolerance | % | ± 10 or specify |
Recommended Soldering Temperature | ℃ | < 300 |
Recommended Soldering Time | S | < 3 |
Storage Temperature | ℃ | - 40 to + 85 |
1Single or dual zone metallization available, mid-span metallization available.
