
Key Features | Applications |
Excellent Hermetic Feedthrough Performance | PLC Module |
LD Packaging | |
Integrated Optics Packaging |
Parameter | Unit | Value |
Max. Insertion Loss | dB | 0.3 |
Max. Helium Leak Rate | Pa. m3/s | 1.0 × 10 - 9 |
Min. Pull Strength | N | 10 |
Max. Average Optical Power | mW | 300 |
Max. Soldering Temperature Allowed | ℃ | 200 |
Storage Temperature | ℃ | - 40 to + 85 |