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AI Clusters & High-Performance Computing
Hyperscale Datacenters & DCI
Silicon Photonics & PIC Integration
Telecom Networks: ROADM & WSS
Optical path optimization, aberration analysis, and stray light suppression
Multi-physics simulation covering optical, thermal and mechanical effects
Opto-thermo-mechanical analysis for structural stability and reliability evaluation
3D modeling, ray tracing, spectral analysis, and transient analysis
Simulation error margin: < 2%
Thermal deformation simulation deviation: < 5%
Precision Optical Shaping: Plano, custom, and freeform optical geometries
Surface Flatness: ≤ λ/10
Ultra-Low Surface Roughness: Ra < 0.5 nm
Supported Materials: Fused Silica, Silicon, TGG, YVO4, LiNbO3 (Lithium Niobate), etc.
100 nm-level X/Y/Z motion control for groove machining
High-Stiffness spindle system to reduce vibration and thermal drift
Process control for high-volume FAU production
AFR uses precision vacuum deposition and sputtering processes to deliver coatings tailored to application requirements. Supported coating types include:
Anti-Reflection (AR) Coatings
High-Reflection (HR) Coatings
Wavelength-selective and broadband beam-splitter coatings
Polarizing and Non-Polarizing Beam Splitter Coatings
Optical Filter Coatings
AFR provides metallization processes for non-metallic substrates and optical fibers to support bonding, packaging, and electrical/thermal integration.
- Available metallization materials include: Titanium (Ti), Nickel (Ni), Chromium (Cr), Molybdenum (Mo), and Gold (Au)
- Supported geometries include flat, cylindrical, and custom surfaces
Stress-rod angular alignment accuracy: ± 0.5°
Polarization extinction ratio (PER): ≥ 23 dB
Simultaneous alignment channels: 8
Translational resolution, X/Y/Z: 0.01 μm
Translational repeatability, X/Y/Z: 0.1 μm
Rotational resolution, θx/θy/θz: 0.003°
Rotational repeatability, θx/θy/θz: 0.005°
X/Y position accuracy: ± 7.0 μm @ 3σ
Angular accuracy, θ: ± 0.5° @ 3σ
Maximum configuration: Up to 20 layers / > 400 channels
Pitch accuracy: ± 0.5 μm (per layer and cumulative)
Fiber protrusion uniformity: ≤ 1 μm
Insertion loss: Typical ≤ 0.3 dB across all channels
Featuring ultra-compact PM structures and sub-micron V-groove alignment, delivering IL ≤ 0.3 dB and PER > 23 dB for next-generation AI clusters.
Featuring a lidless, low-crosstalk 2D design with precision-tapered fiber holes. It delivers low insertion loss and high return loss to support millisecond switching in hyperscale datacenters.