| Key Features | Applications |
| High-precision fiber core alignment for edge-coupled photonic chips | Silicon photonics edge coupling |
| Customizable fiber pitch: 127 μm/250 μm/Customer-Specific (1D or 2D) | Thin-Film lithium niobate modulator coupling |
| Supports SMF, PM fiber, polarization-maintaining fiber arrays, and specialty fibers | Coherent optical modules |
| Optional angled polish for back-reflection reduction | 800G/1.6T optical transceivers |
| Compatible with SiPh, TFLN, InP, PLC, glass, and other photonic platforms | CPO/optical I/O packaging |
| Custom mechanical outline for active/passive alignment and automated assembly | Optical engine assembly |
| Available with lid glass, V-groove substrate, spacer, stopper, and customized bonding area | LiDAR optical modules |
| Suitable for High-Density optical I/O and advanced photonic packaging | Fiber sensing and test systemsMedical and scientific photonic systems |
| Parameter | Unit | Value |
| Wavelength | nm | 1310 |
| Fiber Count | — | 8 ch, 16 ch, 32 ch, 40 ch, 80 ch + (Customizable) |
| Max. Connector Insertion Loss | dB | 0.5 |
| Max. Coupling Insertion Loss | dB | 1 |
| Min. Return Loss | dB | 30 |
| Min. PER | dB | 20 |
| Fiber Pitch Spacing | μm | 84 μm, 127 μm, 250 μm (Customizable) |
| Max. Core Pitch Error | μm | ± 1.0 |
| Fiber Type | — | SM (G.657.A1/A2), PM Fiber, RCBI (Reduced-Clad) |
| Termination Connector Type | — | LC, FC, MPO, MMC, ELSFP Connector (Customizable) |
| Operating Temperature | °C | - 40 °C to + 85 °C |
