
| Key Features | Applications |
| Ultra-Precise Core Pitch Control | CPO (Co-Packaged Optics) |
| Advanced MFD Matching | AI/ML Clusters and GPU-to-GPU Interconnects |
| High-Density & Low-Profile Design | Silicon Photonics (SiPh) Chip-Level Packaging |
| Specialty Fiber Integration | High-Performance Computing (HPC) Architectures |
| Robust Reliability |
| Parameter | Unit | Value |
| Wavelength | nm | 1310 |
| Fiber Count | - | 8 ch, 16 ch, 32 ch,40 ch, 80 ch + (Customizable) |
| Max. Connector Insertion Loss | dB | 0.5 |
| Max. Coupling Insertion Loss | dB | 1 |
| Min. Return Loss | dB | 30 |
| Min. PER | dB | 20 |
| Fiber Pitch Spacing | μm | 84 μm,127 μm, 250 μm (Customizable) |
| Max. Core Pitch Error | μm | ± 0.7 |
| Fiber Type | - | SM (G.657.A1/A2), PM Fiber, RCBI (Reduced-Clad) |
| Termination Connector Type | - | LC, FC, MPO, MMC, ELSFP Connector (Customizable) |
| Operating Temperature | °C | - 40 °C to + 85 °C |