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High-Precision FAU for CPO & Silicon Photonics Interconnects

High-Precision FAU for CPO & Silicon Photonics Interconnects

Vlink’s CPO FAU (Co-Packaged Optics Fiber Array Unit) Connectivity series is engineered to address the critical bottlenecks in Ultra-High-Bandwidth AI and Hyperscale Data Center networks. As the industry transitions to 51.2T and 102.4T switching capacities, our FAU solutions provide the essential bridge between Photonic Integrated Circuits (PICs) and external fiber networks. Designed with Industry-Leading precision, Vlink ensures minimal insertion loss and maximum reliability for co-packaged architectures.
Product Detail
Key FeaturesApplications
Ultra-Precise Core Pitch ControlCPO (Co-Packaged Optics)
Advanced MFD MatchingAI/ML Clusters and GPU-to-GPU Interconnects
High-Density & Low-Profile DesignSilicon Photonics (SiPh) Chip-Level Packaging
Specialty Fiber IntegrationHigh-Performance Computing (HPC) Architectures
Robust Reliability
Specifications
ParameterUnitValue
Wavelengthnm1310
Fiber Count-8 ch, 16 ch, 32 ch,40 ch, 80 ch + (Customizable)
Max. Connector Insertion LossdB0.5
Max. Coupling Insertion LossdB1
Min. Return LossdB30
Min. PERdB20
Fiber Pitch Spacingμm84 μm,127 μm, 250 μm (Customizable)
Max. Core Pitch Errorμm± 0.7
Fiber Type-SM (G.657.A1/A2), PM Fiber, RCBI (Reduced-Clad)
Termination Connector Type-LC, FC, MPO, MMC, ELSFP Connector (Customizable)
Operating Temperature°C- 40 °C to + 85 °C

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