March 25, 2024 - Dr. Sy Rhee attended the forum titled "Technologies and Applications of Thin Film Lithium Niobate Photonics," organized jointly by AFR and HyperLight. During the forum, Dr. Rhee presented a speech titled "TFLN opportunities," discussing the potential and future prospects of thin-film lithium niobate photonics technology.
About Sy Rhee and Fujitsu Optical Components
Sy Rhee is the COO (Chief Operating Officer) of Fujitsu Optical Components America, a subsidiary of Fujitsu Optical Components, Ltd (FOC). He has over 20 years of vast experience in the optical components industry covering product development, marketing, and sales roles. Prior to joining FOC in 2005, Sy was a member of technical staff at Fujitsu Compound Semiconductor and NeoPhotonics. Sy holds Ph.D. degree in Mechanical Engineering from The Ohio State University.
Fujitsu Optical Components (FOC) plays a significant role in optical device and optical module products. In the supply chain of the TFLN, Fujitsu Optical Components is the leading TFLN chip supplier.
Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain
The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.
In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.
As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.
March 25, 2024 - Dr. Xinlun Cai attended the AFR and HyperLight-hosted forum on "Technologies and Applications of Thin Film Lithium Niobate Photonics," delivering a presentation on "High Speed and Low Power Consumption TFLN Devices."
About Xinlun Cai and Liobate
Dr. Xinlun Cai did his PhD in Bristol University, U.K. In 2014, he joined Sun Yat-sen University in China doing research in photonic integrated devices based on silicon and thin-film lithium niobate. He demonstrated a hybrid integrated silicon and TFLN modulators with bandwidth of > 70 GHz, the first IQ TFLN modulators and the first dual-polarization TFLN modulators. The TFLN modulators he demonstrated are with bandwidth of > 110 GHz and half-wave voltage of < 1 V, which is the state-of-the-art. In 2020, he co-founded Liobate Technologies aiming to developing TFLN devices for data-center and AI applications.
Liobate Technologies successfully developed high-speed optical communication chips and devices based on TFLN electro-optic modulator technology. Liobate Technologies is dedicated to developing thin-film lithium niobate modulator photonic integrated circuits and related optical communications and interconnect sub-assemblies.
Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain
The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.
In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight , Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions abut the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.
As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.
March 25, 2024 - Dr. Mingzhi Lu attended the AFR and HyperLight-hosted forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics." At the forum, Dr. Lu delivered a presentation titled "Advantages and Challenges of Thin-Film Lithium Niobate Photonic Integrated Circuits," offering a comprehensive overview of the benefits and challenges associated with TFLN technology.
About Mingzhi Lu and Ori-Chip
Mingzhi Lu received the B.S. degree from Southeast University in 2008, and M.S. and Ph.D. degrees from University of California, Santa Barbara in 2009 and 2013, respectively, in electrical and computer engineering. He also worked as a postdoctoral researcher from 2013 to 2014 at University of California, Santa Barbara. His research was mainly focused on photonic integration and optical phase-locked loops. From 2014 to 2018, he worked at Infinera Corp. on large scale photonic integration for 200G,400G and 800G coherent communication. In 2018, he co-founded Ori-Chip Optoelectronics Technology Co. LTD., making widely tunable lasers, thin-film lithium niobate PICs and DFB laser diodes for communication and sensing markets.
Ori-Chip Optoelectronics Technology has established a full range of semiconductor production lines from R&D and design to chip production, automatic testing and aging verification, and is a leading optical communication chip solution provider in the supply chain of lithium niobate.
Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain
The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.
In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.
As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.