March 25, 2024 - Dr. Mingzhi Lu attended the AFR and HyperLight-hosted forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics." At the forum, Dr. Lu delivered a presentation titled "Advantages and Challenges of Thin-Film Lithium Niobate Photonic Integrated Circuits," offering a comprehensive overview of the benefits and challenges associated with TFLN technology.
About Mingzhi Lu and Ori-Chip
Mingzhi Lu received the B.S. degree from Southeast University in 2008, and M.S. and Ph.D. degrees from University of California, Santa Barbara in 2009 and 2013, respectively, in electrical and computer engineering. He also worked as a postdoctoral researcher from 2013 to 2014 at University of California, Santa Barbara. His research was mainly focused on photonic integration and optical phase-locked loops. From 2014 to 2018, he worked at Infinera Corp. on large scale photonic integration for 200G,400G and 800G coherent communication. In 2018, he co-founded Ori-Chip Optoelectronics Technology Co. LTD., making widely tunable lasers, thin-film lithium niobate PICs and DFB laser diodes for communication and sensing markets.
Ori-Chip Optoelectronics Technology has established a full range of semiconductor production lines from R&D and design to chip production, automatic testing and aging verification, and is a leading optical communication chip solution provider in the supply chain of lithium niobate.
Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain
The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.
In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.
As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.
