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  • TFLN FORUM | Dr. Marko Lončar: High Performance Integrated Photonics based on Thin Film Lithium Niobate
    Mar 27, 2024 TFLN FORUM | Dr. Marko Lončar: High Performance Integrated Photonics based on Thin Film Lithium Niobate

    March 25, 2024 - Dr. Marko Lončar participated in the forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics," held by AFR and HyperLight, and delivered a speech titled "High Performance Integrated Photonics based on Thin Film Lithium Niobate (TFLN)."

    About Marko Lončar and HyperLight

    Marko Lončar is Tiantsai Lin Professor of Electrical Engineering at Harvard's John A Paulson School of Engineering and Applied Sciences (SEAS), and chair of Electrical Engineering area. Lončar received his Diploma from University of Belgrade (R. Serbia) in 1997, and PhD from Caltech in 2003, both in Electrical Engineering. After completing his postdoctoral studies at Harvard, he joined Harvard faculty in 2006. Lončar is expert in nanophotonics and nanofabrication, and his group has done pioneering work in the field of quantum and nonlinear nanophotonics. In particular, Lončar is recognized for his work on the development of diamond and thin film lithium niobate nanophotonic platforms. Lončar has co-authored more than 250 manuscripts in top scientific journals and has given more than 300 invited talks and seminars. He has received NSF CAREER Award in 2009, Sloan Fellowship in 2010, Marko Jarić Foundation Award in 2020, and Microoptics Conference Award in 2023. In recognition of his teaching activities, Lončar has been awarded Harvard University Levenson Prize for Excellence in Undergraduate Teaching (2012), and has been named Harvard College Professor in 2017. Lončar is Fellow of Optica and IEEE. He is co-founder of HyperLight Corporation (Cambridge, MA), VC backed startup commercializing lithium-niobate technology.

    HyperLight was a spin-off of Harvard University with the mission to push the performance boundaries of TFLN integrated circuits for next-generation applications. As a leader in the commercialization of TFLN photonic integrated circuits, HyperLight delivers groundbreaking electro-optic and nonlinear optic solutions with innovative designs and scalable manufacturing processes.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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  • TFLN FORUM | Dr. Sy Rhee: TFLN Opportunities
    Mar 27, 2024 TFLN FORUM | Dr. Sy Rhee: TFLN Opportunities

    March 25, 2024 - Dr. Sy Rhee attended the forum titled "Technologies and Applications of Thin Film Lithium Niobate Photonics," organized jointly by AFR and HyperLight. During the forum, Dr. Rhee presented a speech titled "TFLN opportunities," discussing the potential and future prospects of thin-film lithium niobate photonics technology.

    About Sy Rhee and Fujitsu Optical Components

    Sy Rhee is the COO (Chief Operating Officer) of Fujitsu Optical Components America, a subsidiary of Fujitsu Optical Components, Ltd (FOC). He has over 20 years of vast experience in the optical components industry covering product development, marketing, and sales roles. Prior to joining FOC in 2005, Sy was a member of technical staff at Fujitsu Compound Semiconductor and NeoPhotonics. Sy holds Ph.D. degree in Mechanical Engineering from The Ohio State University.

    Fujitsu Optical Components (FOC) plays a significant role in optical device and optical module products. In the supply chain of the TFLN, Fujitsu Optical Components is the leading TFLN chip supplier.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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  • TFLN FORUM | Dr. Xinlun Cai: High Speed and Low Power Consumption TFLN Devices
    Mar 27, 2024 TFLN FORUM | Dr. Xinlun Cai: High Speed and Low Power Consumption TFLN Devices

    March 25, 2024 - Dr. Xinlun Cai attended the AFR and HyperLight-hosted forum on "Technologies and Applications of Thin Film Lithium Niobate Photonics," delivering a presentation on "High Speed and Low Power Consumption TFLN Devices."

    About Xinlun Cai and Liobate

    Dr. Xinlun Cai did his PhD in Bristol University, U.K. In 2014, he joined Sun Yat-sen University in China doing research in photonic integrated devices based on silicon and thin-film lithium niobate. He demonstrated a hybrid integrated silicon and TFLN modulators with bandwidth of > 70 GHz, the first IQ TFLN modulators and the first dual-polarization TFLN modulators. The TFLN modulators he demonstrated are with bandwidth of > 110 GHz and half-wave voltage of < 1 V, which is the state-of-the-art. In 2020, he co-founded Liobate Technologies aiming to developing TFLN devices for data-center and AI applications. 

    Liobate Technologies successfully developed high-speed optical communication chips and devices based on TFLN electro-optic modulator technology. Liobate Technologies is dedicated to developing thin-film lithium niobate modulator photonic integrated circuits and related optical communications and interconnect sub-assemblies.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight , Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions abut the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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  • TFLN FORUM | Dr. Mingzhi Lu: Advantages and Challenges of TFLN Photonic Integrated Circuits
    Mar 27, 2024 TFLN FORUM | Dr. Mingzhi Lu: Advantages and Challenges of TFLN Photonic Integrated Circuits

    March 25, 2024 - Dr. Mingzhi Lu attended the AFR and HyperLight-hosted forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics." At the forum, Dr. Lu delivered a presentation titled "Advantages and Challenges of Thin-Film Lithium Niobate Photonic Integrated Circuits," offering a comprehensive overview of the benefits and challenges associated with TFLN technology.

    About Mingzhi Lu and Ori-Chip

    Mingzhi Lu received the B.S. degree from Southeast University in 2008, and M.S. and Ph.D. degrees from University of California, Santa Barbara in 2009 and 2013, respectively, in electrical and computer engineering. He also worked as a postdoctoral researcher from 2013 to 2014 at University of California, Santa Barbara. His research was mainly focused on photonic integration and optical phase-locked loops. From 2014 to 2018, he worked at Infinera Corp. on large scale photonic integration for 200G,400G and 800G coherent communication. In 2018, he co-founded Ori-Chip Optoelectronics Technology Co. LTD., making widely tunable lasers, thin-film lithium niobate PICs and DFB laser diodes for communication and sensing markets.

    Ori-Chip Optoelectronics Technology has established a full range of semiconductor production lines from R&D and design to chip production, automatic testing and aging verification, and is a leading optical communication chip solution provider in the supply chain of lithium niobate.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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  • TFLN FORUM | Dr. Jianying Zhou: Exploiting TFLN Photonics for New Generation Optical Transceivers in Data Center Applications
    Mar 27, 2024 TFLN FORUM | Dr. Jianying Zhou: Exploiting TFLN Photonics for New Generation Optical Transceivers in Data Center Applications

    March 25, 2024 - Dr. Jianying Zhou attended the AFR and HyperLight co-host forum, discussing the latest advancements in Thin Film Lithium Niobate Photonics. His presentation, titled "Exploiting Thin Film Lithium Niobate Photonics for New Generation Optical Transceivers in Data Center Applications," highlighted the potential of this technology in enhancing data transmission efficiency.

    About Jianying Zhou and Hisense Broadband Multimedia Technology

    Jianying Zhou is currently the VP of Technology at Hisense Broadband. Previously, he was a Director of R&D and a Principal Engineer with Intel Corporation, a Director of Design and Technology with NeoPhotonics Corporation, and a number of professional positions with Oclaro, Finisar, Nortel, JDS, etc. He has been working in the optoelectronics and fiber-optic communication industries for over 25 years. In recent years, he has conducted advanced photonics technology and product development with contributions in a number of conference presentations and journal papers, including a top scored paper in OFC 2019, an invited paper in OFC 2020, a postdeadline paper in 2023 IEEE Silicon Photonics Conference, and invited papers in JLT and JSTQE. His interests include silicon photonics, emerging photonic technology, photonic integration, and advanced packaged and optical transceivers.

    Hisense Broadband is a global leader in the development and manufacturing of advanced fiber optical transceivers and multimedia terminals. With over 20 years of experience, Hisense Broadband provides one-stop solutions for Datacom, transmission, wireless and access networks.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

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  • TFLN FORUM | Richard Xiao: Opportunities and Challenges of Applying TFLN in High Speed Optical Transceivers
    Mar 27, 2024 TFLN FORUM | Richard Xiao: Opportunities and Challenges of Applying TFLN in High Speed Optical Transceivers

    March 25, 2024 - Richard Xiao was a featured speaker at the "Technologies and Applications of Thin Film Lithium Niobate Photonics" forum, hosted jointly by AFR and HyperLight. His presentation, titled " Opportunities and challenges of Applying TFLN in High Speed Optical Transceivers," provided an insightful analysis of the current state and future prospects of this emerging technology.

    About Richard Xiao and Linktel

    Richard Xiao is the Vice President at Linktel Technologies, where he is involved in the development of emerging technologies for the next generation of optical interconnections, such as 200G per Lane, Thin Film Lithium Niobate, Silicon Photonics, etc. Prior to joining Linktel, he worked in various leadership and engineering roles at Alcatel-Lucent, Tellabs, Cisco, and TFC. He has more than 20 years of industry experience in product development, commodity management, and product marketing. 

    Linktel is a technology-oriented company that specializes in pluggable transceivers for Metro, Wireless, Access, Enterprise networks, and Data Centers, as well as optical engines used in high-speed optical links and transceiver modules. Linktel's 800G optical transceiver with TFLN modulator meets the high-speed requirements of data-heavy applications.

    Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

    The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

    In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

    As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

    View more
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