March 25, 2024 - Richard Xiao was a featured speaker at the "Technologies and Applications of Thin Film Lithium Niobate Photonics" forum, hosted jointly by AFR and HyperLight. His presentation, titled " Opportunities and challenges of Applying TFLN in High Speed Optical Transceivers," provided an insightful analysis of the current state and future prospects of this emerging technology.

About Richard Xiao and Linktel

Richard Xiao is the Vice President at Linktel Technologies, where he is involved in the development of emerging technologies for the next generation of optical interconnections, such as 200G per Lane, Thin Film Lithium Niobate, Silicon Photonics, etc. Prior to joining Linktel, he worked in various leadership and engineering roles at Alcatel-Lucent, Tellabs, Cisco, and TFC. He has more than 20 years of industry experience in product development, commodity management, and product marketing. 

Linktel is a technology-oriented company that specializes in pluggable transceivers for Metro, Wireless, Access, Enterprise networks, and Data Centers, as well as optical engines used in high-speed optical links and transceiver modules. Linktel's 800G optical transceiver with TFLN modulator meets the high-speed requirements of data-heavy applications.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 - At the "Technologies and Applications of Thin Film Lithium Niobate Photonics" forum co-hosted by AFR and HyperLight, Dr. Hui Hu gave a speech entitled "Thin Film Lithium Niobate for Integrated Photonics," discussing the latest advancements and potential applications of thin film lithium niobate in the field of integrated photonics.

About Hui Hu and NanoLN

Hui Hu earned his B.S. and Ph.D. degrees in Physics from Shandong University in 1996 and 2001, respectively. From 2001 to 2003, he was a post-doc at Tsinghua University, China. From 2004 to 2010, he was in University of Paderborn, Germany, as an Alexander von Humboldt Research Fellow and a post-doc. Since 2011, he has been the CTO of NanoLN company and a professor at Shandong University. His research is focused on thin film materials, nanofabrication, and integrated photonics.

NanoLN is specialized in producing single-crystal lithium niobate thin films (TFLN/LNOI) and single-crystal lithium tantalate thin films (TFLT/LTOI). It also provides wafer thinning and PECVD (Plasma-enhanced chemical vapor deposition) services for its customers, enabling them to use the wafer for production.

Emergence of a Mature, Comprehensive, and Reliable TFLN Supply Chain

The optimistic outlook within the TFLN industry is attracting numerous technology companies, leading to the swift evolution of a comprehensive ecosystem. It is encouraging to note that an increasing number of technology enterprises and startups worldwide are converging onto this track, shaping the future of the industry collectively, covering materials, wafers, chips, modulators, and optical modules.

In the panel discussion, representatives from key players of the supply chain, including NanoLN in wafer manufacturing, AFR, HyperLight, Liobate, Ori-Chip, and FOC in chip production, Hisense and Linktel in transceivers, exchanged opinions about the prospect of TFLN, technology breakthroughs, and how to make it more ready for near future large volume applications.

As we observe together, the TFLN supply chain is steadily maturing, becoming more comprehensive and reliable over time. The growth and integration of each component signify a promising future for TFLN technology, establishing it as a pivotal player in the global technological landscape.

March 25, 2024 – AFR and HyperLight joined forces on March 25, 2024, to organize the highly anticipated forum, "Technologies and Applications of Thin Film Lithium Niobate Photonics," held at the San Diego Convention Center.

The relentless expansion of data traffic in fiber-optic communication networks, driven by emerging applications like artificial intelligence (AI) and big data, has become a catalyst for innovation. The increasing demand for high-speed optical devices capable of handling the growing workload necessitates a closer look at TFLN.

Table 1. Comparison of Material Technology for Optical Devices

Mar. 8, 2024 - The inaugural Asia Photonics Expo (APE) concluded at Sands Expo and Convention Centre in Singapore. APE has brought together 350 exhibitors and many attendees from all over the world, serving as a platform for showcasing the latest technologies, exchanging ideas, and fostering partnerships. AFR and its subsidiary, VLINK, showcased a variety of products, including 1550 nm LiDAR light source, 130 GBaud TFLN CDM, Micro-Connectivity Products, etc., which attracted great attentions.

1550 nm LiDAR Light Source

AFR's LiDAR Light Source features a pulse width and repetition rate tunable design for higher pulse energy and peak power. The product has industry-leading E-O efficiency and stability in a compact package. AFR also provides customized light source services.

130 GBaud TFLN CDM

A quad-channel 130 GBaud High-Bandwidth CDM integrated with

RF driver, designed for 800 Gb/s or 1.2 Tb/s coherent optical communication systems.

Micro-Connectivity Products

VLINK presented its flagship products during the event, including 400G DR4 Assembly, 90° Fiber Bending FAU and 24F Protrusion FAU, widely being used in 400G/800G/1.6T high speed/ultra-high-speed optical modules, PIC/CPO applications, coherent optical communications and WSS modules.

Feb. 1, 2024 The much-anticipated Photonics West 2024 concluded at the Moscone Center in San Francisco. With over 1,500 manufacturers and research institutions from around the world gathering on-site, the event served as a platform for unveiling the latest advancements and discussing emerging industry trends.

Among the many of exhibitors, Advanced Fiber Resources (AFR) emerged as a standout, captivating attendees with their innovative and diversified product portfolio, which includes LiDAR light source, lithium niobate modulators, fiber laser components, etc. Here are some of the highlights from AFR's showcase:

1550 nm LiDAR Light Source

AFR's LiDAR Light Source features a pulse width and repetition rate tunable design for higher pulse energy and peak power. The product has industry-leading E-O efficiency and stability in a compact package. AFR also provides customized light source services.

Swept Tunable Laser Module

Arcadia Optronix's (AFR wholly owned subsidiary) Swept Tunable Laser Module offers a wavelength range of 1528 to 1568 nm and a sweep speed of up to 2 kHz. The output power reaches 20 mW while maintaining wavelength stability < 1 pm.

500 W Fiber to Free Space Isolator

AFR proprietary design and award-winning product (Laser Focus World Innovators Awards 2023) with unparalleled performance for fiber laser application.

130 GBaud TFLN Coherent Driver Modulator

A quad-channel 130 GBaud High-Bandwidth Coherent Driver Modulator integrated with RF driver, designed for 800 Gb/s or 1.2 Tb/s coherent optical transport systems and transceivers.

For more information about all products above, please contact sales@fiber-resources.com or visit our product center at www.fiber-resources.com.

Dec. 27, 2023 – The relentless expansion of data traffic in fiber-optic communication networks, fueled by emerging technologies such as artificial intelligence (AI) and big data, has become a driving force for innovation. According to Allied Market Research, the global data center market is anticipated to soar to $24.6 billion by 2031, with a remarkable compound annual growth rate (CAGR) of 5.9%. This surge in data transmission demands high-speed optical devices capable of handling the increased workload.

Key Advantages of TFLN Material

Conventional optical modules currently employ chips based on silicon photonics and indium phosphide platforms. Nevertheless, constraints in material bandwidth and suboptimal linearity have given rise to bottlenecks for applications exceeding 800 Gbps. A revolutionary solution to these challenges arises with the introduction of thin-film lithium niobate (TFLN) material.

In Table 1, TFLN emerges as a promising material technology, surpassing mature counterparts like LiNbO₃, InP, and SiPh. Notably, TFLN stands out with its remarkable advantages in low optical loss and large bandwidth. Its excellence extends to key performance factors like Half-Wave Voltage, Extinction Ratio, Linearity, and Seamless Integration, marking it as a leading contender in optical innovation. As the technology matures and market applications broaden, the cost of TFLN is expected to decrease, driven by economies of scale in production.

TFLN Industry Chain Solidifies for Future Breakthroughs

The optimistic outlook of the TFLN industry is drawing numerous technology enterprises, fostering the rapid development of a complete ecosystem. Key players such as AFR (headquartered in Zhuhai, China), HyperLight (based in Cambridge, MA, USA), Liobate (situated in Nanjing, China), NanoLN (located in Jinan, China) and Novel Si Integrated Technology (based in Shanghai, China) have pledged their dedication to forging a robust chain in this burgeoning field, covering materials, wafers, chips, modulators, and optical modules. With a unified commitment to collaboration across the industrial chain, the year 2024 is expected to witness remarkable breakthroughs in this rapidly evolving sector.